Benefits of thermal pad:
The heat conduction pad is very suitable for filling uneven surfaces and gaps. It can make the contact surface between the heating element and the radiating device better contact to achieve true surface contact and maximize heat transfer.
High thermal conductivity:
Upgraded thermal silica gel material with 12 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
Excellent performance:
Ultra-high thermal conductivity, soft & compressible, non-conductive, electrically insulating, high temperature resistance, wear resistant, anti static, fire retardant, buffering, no toxic, odorless, no corrosion, no stimulation, no damage to metal materials.
High durability:
Extremely stable, in the temperature range of -40℃-200℃ will not melt, once applied, it will continue to work for at least 5 years, will not reduce the cooling performance with the passage of time.
Security application:
The thermal pads is non-electrical conductive, which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.
Widely applications:
The thermal pad is designed for laptop heatsink, cpu, gpu, vga, ram, ssd, vram, hdd, m2 hard disk box, drive, nvme, module, ic chips, southbridge, northbridge, processor, video card, memory chipset, graphics, computer pc aluminum/copper heat sinks, circuit board, logic board, led cooler, tv set-top, router, game console, raspberry pi, ps4, 3d printer and more heating element.
Easy to apply:
You can choose the appropriate thickness of the heat conduction silicone pad according to the gap between the heating element and the radiator, and install it by cutting the required size.
Benefits of thermal pad:
The heat conduction pad is very suitable for filling uneven surfaces and gaps. It can make the contact surface between the heating element and the radiating device better contact to achieve true surface contact and maximize heat transfer.
High thermal conductivity:
Upgraded thermal silica gel material with 12 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
Excellent performance:
Ultra-high thermal conductivity, soft & compressible, non-conductive, electrically insulating, high temperature resistance, wear resistant, anti static, fire retardant, buffering, no toxic, odorless, no corrosion, no stimulation, no damage to metal materials.
High durability:
Extremely stable, in the temperature range of -40℃-200℃ will not melt, once applied, it will continue to work for at least 5 years, will not reduce the cooling performance with the passage of time.
Security application:
The thermal pads is non-electrical conductive, which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.
Widely applications:
The thermal pad is designed for laptop heatsink, cpu, gpu, vga, ram, ssd, vram, hdd, m2 hard disk box, drive, nvme, module, ic chips, southbridge, northbridge, processor, video card, memory chipset, graphics, computer pc aluminum/copper heat sinks, circuit board, logic board, led cooler, tv set-top, router, game console, raspberry pi, ps4, 3d printer and more heating element.
Easy to apply:
You can choose the appropriate thickness of the heat conduction silicone pad according to the gap between the heating element and the radiator, and install it by cutting the required size.
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