This is MVTECH’s Heat sink compound (Aka Thermal grease, thermal paste, and thermal ). Use this whenever you’re connecting a component to a heat sink, it’ll really help to dissipate even more potentially damaging heat. This HY500 series thermal grease offer better cooling performance with high thermal conductivity graphite and powder. This thermal grease should be used to fill the gaps and expanding cooling area between the component and the heat sink.It has a thermal conductivity of 1.172 W/(mK), which should be plenty for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.FeaturesColor: GreyWeight: (N.W) (as the picture)Thermal conductivity > 1.172 W/m-kThermal Impedance <0.225Specific Gravity >2.0Viscosity 1000Thixotropic Index 380+_10Viscosity -50~300Operation Temperature -30~300Silicone Compounds 50%Carbon Compounds 30%Metal Oxide Compounds 20%Graphite Thermal Grease, thermal Conductivity 1.93W/m-k~2.15W/m-kGood Electric Insulating, Breakdown 10Kv voltageLow Thermal Impedance, Keep grease condition with long timeWith a wide range working temperature, keep stable performance at temperature -30~300 High performanceApplications:Cooling device to the end plate heat sinkHigh speed and large storage DrivesAutomotive Engine controlsHard disk drive and DVD drivesPower conversion apparatusHigh Power LEDsNotebook and desktop computersNetwork Communication EquipmentHousehold appliances, electronic components, electrical
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